发明名称 TWO-LAYER FLEXIBLE BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a two-layer flexible board on which a copper skin film layer with high insulation reliability is formed, wherein no defect exists in a copper conductor and adhesion between an insulation film and a background metallic layer is excellent, and to provide a manufacturing method thereof. SOLUTION: The two-layer flexible board comprises the base metallic layer with a layer thickness of 5 to 50 nm, mainly containing nickel-chromium alloy including 12 to 22 atom.% of chromium and nickel as the rest and formed on the insulation film by the dry plating method; and the copper film layer with a film thickness of 10 nm to 12μm formed on the base metallic layer, wherein the base metallic layer is directly formed on at least one side of the insulating film not via an adhesive, and the copper conductor layer with a desired layer thickness is formed on the background metallic layer. The background metallic layer mainly containing the nickel-chromium alloy is formed on the insulation film by the dry plating method, and the copper film layer is formed on the background metallic layer by the dry plating method. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006013152(A) 申请公布日期 2006.01.12
申请号 JP20040188449 申请日期 2004.06.25
申请人 SUMITOMO METAL MINING CO LTD 发明人 ASAKAWA YOSHIYUKI;WATANABE HIROTO
分类号 H05K1/09;C23C18/38;H05K3/00 主分类号 H05K1/09
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