发明名称 Structure and method of vertical transistor DRAM cell having a low leakage buried strap
摘要 A structure and method is disclosed herein for a vertical transistor DRAM cell having a low leakage buried strap outdiffusion conductively connecting a storage capacitor in a lower portion of a trench to a vertical transistor thereabove. In the disclosed structure and method, the buried strap outdiffusion (BSOD) extends along a portion of the isolation collar having reduced thickness, the reduced thickness being substantially less than the thickness of the isolation collar otherwise. In a particular embodiment, a self-aligned lightly doped drain (LDD) extension is formed, extending between the BSOD and the vertical transistor above the LDD.
申请公布号 US6979851(B2) 申请公布日期 2005.12.27
申请号 US20020265558 申请日期 2002.10.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHIDAMBARRAO DURESETI;MANDELMAN JACK ALLAN;RADENS CARL JOHN
分类号 G11C11/24;H01L21/8242;H01L29/76;(IPC1-7):H01L29/76 主分类号 G11C11/24
代理机构 代理人
主权项
地址
您可能感兴趣的专利