发明名称 |
SOLID-STATE IMAGING DEVICE STORAGE PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device storage package which uses a thermoplastic resin for an insulation substrate but has no moisture staying inside. SOLUTION: The solid-state imaging device storage package comprises: the insulation substrate 1 having a recess 1a for storage formed in the top face to store a solid-state imaging device 3; and a lid 2 consisting of a glass resin plate, etc. which is fixed on the top face of the insulation substrate 1 by a resin sealing material 7 to cover the opening of the recess 1a for storage. The insulation substrate 1 and the lid 2 form a container 4 for storing the solid-state imaging device 3. The insulation substrate 1 is formed of a thermoplastic resin having a moisture absorbing property. In the boundary between the external surface of the insulation substrate 1 and each lead terminal 5 and its periphery, an adhesion 8 formed of a thermosetting resin adhesive is formed to seal those parts, while an adhesion 9 formed of a thermosetting resin adhesive is formed in the boundary between the internal surface of the recess 1a for storage of the insulation substrate 1 and each lead terminal 5 and its periphery to seal these parts. The adhesion portions 9 are formed from above a step portion 1b over to the internal surface of the recess 1a for storage. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005347336(A) |
申请公布日期 |
2005.12.15 |
申请号 |
JP20040162350 |
申请日期 |
2004.05.31 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SHIBATA KIWAMU;HIRATA MASAYA |
分类号 |
H01L27/14;H01L23/02;H01L23/04;H01L23/08;H04N5/335;(IPC1-7):H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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