| 发明名称 |
LEADLESS LEADFRAME WITH AN IMPROVED DIE PAD FOR MOLD LOCKING |
| 摘要 |
A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.
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| 申请公布号 |
US2005258521(A1) |
申请公布日期 |
2005.11.24 |
| 申请号 |
US20040851112 |
申请日期 |
2004.05.24 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
PARK SANG-BAE;LEE YONG-GILL;PARK HYUNG-JUN;RHO KYUNG-SOO;WON JIN-HEE |
| 分类号 |
H01L21/58;H01L23/31;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/58 |
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