| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamic acid and a polyimide used for a tape-automated bonding (TAB) method or a chip-on film (COF) method for mounting electronic parts which exhibit excellent adhesion between a polyimide film and a metal. SOLUTION: The adhesive comprises the polyamic acid, obtained from a tetracarboxylic dianhydride containing an alicyclic tetracarboxylic dianhydride compound having a specific tricyclic structure and a diamine, and the polyimide obtained by dehydrating imidation ring closure thereof. COPYRIGHT: (C)2006,JPO&NCIPI |
