Laminar and abrasive machining device for e.g. crystalline silicon wafer, has supporting device with surface bearing and bearing supports supporting rear side of work disk which is pressed against carrier`s front with work piece

摘要

The device has a work piece carrier (2) supported by a press stamp that is supported in such a way that the carrier and a work piece on the carrier are pressed against the front side of a work disk (5). A supporting device has a surface bearing (6) and bearing supports (8) supporting the rear side of the work disk which is pressed against on the front of the carriers with the work piece.