发明名称 Semiconductor device and method of manufacturing thereof
摘要 On the surface of a silicon nitride film, there is formed a thermal oxide film, over which a CVD oxide film is then formed to provide a silicon oxide film of two-layered structure films. Moreover, the total thickness of the two-layered structure films is set to a value from 5 nm to 30 nm. Thus, the silicon oxide film is made into the two-layered structure films of the thermal oxide film and the CVD oxide film to thereby achieve the thickness of the silicon oxide film. As a result, it is possible to prevent a Vth from being lowered by a charge trap phenomenon and to prevent the Vth from fluctuating due to the enlargement of the bird's beak length by the silicon oxide film.
申请公布号 US2005236664(A1) 申请公布日期 2005.10.27
申请号 US20050110826 申请日期 2005.04.21
申请人 DENSO CORPORATION 发明人 AOKI TAKAAKI;SUZUKI MIKIMASA;TSUZUKI YUKIO;SHIGA TOMOFUSA
分类号 H01L29/78;H01L21/331;H01L21/336;H01L21/8247;H01L27/115;H01L29/423;H01L29/51;H01L29/739;(IPC1-7):H01L29/78 主分类号 H01L29/78
代理机构 代理人
主权项
地址