发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SEMICONDUCTOR DEVICE |
摘要 |
<p>A semiconductor device has antenna pads and a testing pad formed on the substrate. An insulating resin layer containing a filler covers the testing pad, and bumps are provided on the antenna pads. Specific data in the semiconductor device are inhibited from being read out or rewritten, by the provision of the insulating resin layer containing a filler.</p> |
申请公布号 |
KR20050097445(A) |
申请公布日期 |
2005.10.07 |
申请号 |
KR20040074621 |
申请日期 |
2004.09.17 |
申请人 |
FUJITSU LIMITED |
发明人 |
MATSUKI HIROHISA;IKUMO MASAMITSU |
分类号 |
H01L27/04;H01L21/60;H01L21/66;H01L21/822;H01L23/48;H01L23/498;H01L23/52;H01L23/58;(IPC1-7):H01L21/66 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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