PATTERN SUBSTRATE, MANUFACTURING METHOD FOR PATTERN SUBSTRATE AND MANUFACTURING APPARATUS FOR PATTERN SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a uniform pattern substrate in which layer thickness of an ink layer is nearly same and which has no pattern unevenness.

SOLUTION: The pattern substrate has: a substrate body; an ink adhering part forming layer which is provided on the substrate body and which forms a plurality of ink adhering parts arranged on the substrate body; and an ink layer provided at each of the plurality of ink adhering parts. A manufacturing method for the pattern substrate has an ink adhering step for adhering ink on a plurality of ink adhering parts arranged in a row by using a head equipped with a plurality of ink adhering means corresponding to the plurality of ink adhering parts. In the ink adhering step, ink is adhered so that ink solid content weight at an inside part differs from that at both sides part in the plurality of ink adhering parts arranged in a row.

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