发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device including a low resistance and thin film silicide layer in a source/drain region, and also to provide a manufacturing method thereof. SOLUTION: The semiconductor device 100 comprises: a semiconductor layer 10; a gate insulating layer 20 provided at the upper part of the semiconductor layer 10; a gate electrode 22 provided at the upper part of the gate insulating layer 20; an impurity layer 26 to form a source region or a drain region provided at least on the semiconductor layer 10; a silicide layer 40 provided at the upper part of the source region or drain region; and a silicide forming reaction controlling region 30 provided within the impurity layer 26. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268272(A) 申请公布日期 2005.09.29
申请号 JP20040074242 申请日期 2004.03.16
申请人 SEIKO EPSON CORP 发明人 HARA HISAKI
分类号 H01L21/28;H01L21/336;H01L29/417;H01L29/78;H01L29/786;(IPC1-7):H01L29/78 主分类号 H01L21/28
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