| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of acquiring a part with a small process margin as an workmanship test position in the workmanship test of a semiconductor. <P>SOLUTION: The appearance of a semiconductor wafer is inspected to search for positions of detected defects on layout data, they are grouped based on the similarity of the layout data to extract a layout pattern for detecting the effects at a high frequency, and the existing position of the extracted layout pattern is acquired as a workmanship test position. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
