| 摘要 |
PROBLEM TO BE SOLVED: To provide lead-free solder capable of maintaining joining strength under high temperature, and also to provide its manufacturing method and an electronic component that is hierarchically connected at high temperature using this lead-free solder. SOLUTION: Using the lead-free solder containing, in a first alloy phase composed of an Sn base alloy, a second alloy phase composed of Sb alloy having a melting point higher than that of the first alloy phase, joining strength can be maintained at a high temperature, enabling high temperature hierarchical connection. COPYRIGHT: (C)2005,JPO&NCIPI |
