发明名称 |
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PLATING METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of depositing a plating film having excellent adhesiveness to a base material by a simple means without performing etching by harmful chromic acid or the like. SOLUTION: This pretreatment agent for electroless plating contains cation exchange resin fine powder and coating film forming resin. Before the electroless plating step, pretreatment agent for plating is applied on a surface of a non-conductive base material and a coating film is formed thereon. Then, the coating film is immersed in aqueous solution containing metal ions to adsorb metal ions on the surface of the coating film of the pretreatment agent. Further, metallic nuclei are formed by the chemical reducing treatment, and the electroless plating is performed. The plating film having excellent adhesiveness can be obtained by the anchor effect to be represented by unevenness of the shape of ion exchange resin fine powder densely present on the surface of the coating film. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005248220(A) |
申请公布日期 |
2005.09.15 |
申请号 |
JP20040057176 |
申请日期 |
2004.03.02 |
申请人 |
FUKUOKA PREFECTURE;MUROMACHI CHEMICAL KK;AON CHEMICAL:KK |
发明人 |
MIHATA HIROAKI;TANAKA TOMOKI;NAGANO HIROSHI;TSURU YUTAKA |
分类号 |
C23C18/18;(IPC1-7):C23C18/18 |
主分类号 |
C23C18/18 |
代理机构 |
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