发明名称 COMPONENT TRANSFER DEVICE, SURFACE MOUNTING APPARATUS, AND COMPONENT TESTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a component transfer device which is compact in structure but has high transfer efficiency by transferring many electronic components by sucking or by other methods and can be reduced in time required for imaging the sucked electronic components, and to provide a surface mounting apparatus and a component testing apparatus equipped with the component transfer devices, respectively. <P>SOLUTION: The component transfer device comprises a movable head unit 6, turrets 16b which are mounted on the head unit 6 to support base end sides of suction nozzles 17, and a camera 18 for imaging sucked electronic components C. The turrets 16b are so supported as to be rotated around a horizontal axis, and installed in a plurality of number in the horizontal axial direction. The suction nozzles 17 are assembled in each turret 16b so that their horizontal axial directions may be radial from the center of rotation of the horizontal axis. The camera 18 is so structured as to image the electronic components C sucked by the suction nozzles 17 as a batch in a state that the suction nozzles 17 of different turrets 16b are oriented in the same direction. The surface mounting apparatus and the component testing apparatus are equipped with the component transfer devices, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251783(A) 申请公布日期 2005.09.15
申请号 JP20040056014 申请日期 2004.03.01
申请人 I-PULSE CO LTD;YAMAHA MOTOR CO LTD 发明人 OKAZAKI SHINICHI;NAKAMURA AKIHIKO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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