| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-throughput semiconductor exposure device capable of reducing a drive time, improving positioning precision, and having high overlapping precision. <P>SOLUTION: This positioning mechanism including at least two or more positioning steps is provided with a first holding part 12 holding a reticle 6 as a positioned positioning object, a second holding part 2 performing a part of the positioning steps, and a reticle replacement hand 4 conveying the reticle from the second holding part 2 to the first holding part 12, and a displacement of the reticle 6 generated in the first holding part 12 is corrected in the second holding part 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
