| 发明名称 |
METHOD AND SYSTEM FOR FORMING SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and a system for forming a semiconductor device. <P>SOLUTION: A method for forming a semiconductor device comprises: forming a three-dimensional (3D) pattern (405) in a substrate (415); and depositing at least one material (410) on the substrate (415) in accordance with desired characteristics of the semiconductor device. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005217417(A) |
申请公布日期 |
2005.08.11 |
| 申请号 |
JP20050020698 |
申请日期 |
2005.01.28 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
MEI PING |
| 分类号 |
B81C99/00;G03F7/00;H01L21/027;H01L21/308;H01L21/3213;H01L21/82;H01L21/822;H01L21/8239;H01L27/04;H01L27/10;H01L27/105;(IPC1-7):H01L21/027;B81C5/00 |
主分类号 |
B81C99/00 |
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