| 摘要 |
A sensing device (28, 32, 34) for sensing a condition of a plasma processing system component (60, 14, 24). The sensing device (28, 32, 34) includes a main body configured to contain a material, an emitter contained in the main body and configured to emit light when exposed to a plasma, and a mating feature connected to the main body and configured to be mated with a receiving feature of an object in the plasma processing system (1) such that the emitter material is exposed to a processing environment (12) of the plasma processing system (1). When the emitter material is exposed to a plasma, the light emitted from the emitter can be monitored to determine at least one of material accumulation on the system component and erosion of the system component. |
