发明名称 FORMING DIE ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a forming die assembly capable of smoothly extracting the resin of a submarine gate part. SOLUTION: The forming die assembly has a submarine gate 15 piercing through the movable die 12 from the leading end of a runner 14 to communicate with a cavity 13. An extrusion member 23 for extruding the runner 14 is provided to the movable die 12 so as to advance and retreat in a die on-off direction to extrude the resin R at the part of the runner 14 between the submarine gate 15 and a runner locking part 16. The resin R in the runner 14 is bent by extruding the resin R in the runner 14 by the extrusion member 23 to smoothly extract the resin R in the runner 14 from the submarine gate 15. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005193495(A) 申请公布日期 2005.07.21
申请号 JP20040001496 申请日期 2004.01.06
申请人 MITSUBISHI MATERIALS CORP 发明人 YAMAMOTO KUNIO;TAKEISHI ATSUSHI
分类号 B29C45/30;B29C45/56;(IPC1-7):B29C45/30 主分类号 B29C45/30
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