| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave chip and a surface acoustic wave device suitable for reduction in size and thickness. SOLUTION: The surface acoustic wave chip 10 comprises a conduction part 26 of such a metal as a native oxide is not deposited easily provided, on one surface 20 of a piezoelectric substrate 12, with a conduction pattern 24 of such a metal as a native oxide is not deposited easily as compared with the metal forming an interdigital electrode 14, and provided with the interdigital electrode 14 electrically connected with a part of the conduction pattern 24 and extended to the other surface 22 through the side face of the piezoelectric substrate 12. The surface acoustic wave device 42 is arranged such that the conduction part 26 on the other surface 22 of the surface acoustic wave chip 10 is connected electrically and mechanically onto a mount electrode 36 provided on the bottom face of a package base 30 through a conductive bonding material 38 and a lid 40 is bonded to the upper surface of the package base 30. COPYRIGHT: (C)2005,JPO&NCIPI
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