发明名称 UNDERFLOOR HEATING DEVICE AND BUILDING
摘要 PROBLEM TO BE SOLVED: To provide an underfloor heating device capable of improving the energy consumption efficiency of a heat pump. SOLUTION: The heat pump 5 is installed outdoor, the hot water heated by the heat pump 5 is sent to a radiator 2b mounted on an underfloor space 2a of a house place 2 first by a circulating passage 6 to heat the underfloor space 2a, then continuously sent to a radiator 3b mounted on an underfloor space 3a of a kitchen 3 and a radiator 4b laid on an underfloor space 4a of a corridor, when a temperature of a heat medium is lowered to be less than a specific set temperature, and returned to the heat pump 5 to be circulated. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005188823(A) 申请公布日期 2005.07.14
申请号 JP20030430724 申请日期 2003.12.25
申请人 SEKISUI CHEM CO LTD 发明人 ASAGIRI DAISUKE
分类号 F24D3/14;F25B6/04;(IPC1-7):F24D3/14 主分类号 F24D3/14
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