POLISHING PAD FOR CMP AND METHOD OF POLISHING USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad for a CMP in which polishing slurry is held suitably between a surface to be polished and the polishing pad, and which can obtain a polishing rate in the surface to be polished uniformly without the excess consumption of the polishing slurry.

SOLUTION: The polishing pad for the CMP includes an inner radial groove 10 elongated from the center of a circular polishing pad 1 to a region of 1/3 to 2/3 of a radius, and an outer radial groove 20 elongated from the outer periphery of the circular polishing pad to a region of 1/3 to 2/3 of the radius on the polishing surface.

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