| 摘要 |
PROBLEM TO BE SOLVED: To allow a semiconductor element to dissipate heat efficiently without damaging semiconductor chips in the element nor deteriorating electrical characteristics of the element. SOLUTION: A recess 10 for a heat dissipating seat 9 is formed on the bottom face 7A of a mounting seat 7 of a heatsink 6. The heat dissipating seat 9 is placed in the recession 10, and the source electrode 3 of a power FET1 is screwed to the bottom face 7A of the mounting seat 7 of the heatsink 6. COPYRIGHT: (C)2005,JPO&NCIPI |
