发明名称 ELECTRONIC PART PACKAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus which can inspect simply the positional deviation of a mounting part and the existence of the mounting part with a simple configuration. <P>SOLUTION: In the electronic part packaging apparatus, marks 5, 5' are added to adsorbed part 18 by stamps 6, 6'. A part recognition is performed by a part recognition camera 16, an adsorption deviation is corrected, and the part is mounted on a substrate 4. When the adsorption deviation is corrected by the part recognition, a mark position is corrected for the adsorption deviation part, and, accordingly, after the part is mounted, the mark is recognized by a mark recognition camera 17, and whether the mark exists at the corrected position or not is inspected. If the mark is not recognized in an allowed range, it is judged that there is the mounting deviation. With such a constitution, a special inspecting unit is not required. And, the part mounting inspection can be performed with a simple inspection algorithm without needing image data of the substrate before the part is mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166769(A) 申请公布日期 2005.06.23
申请号 JP20030400946 申请日期 2003.12.01
申请人 JUKI CORP 发明人 ABE YOSHIAKI
分类号 H05K13/04 主分类号 H05K13/04
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