SEMICONDUCTOR WAFER, MANUFACTURING METHOD THEREFOR AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To prevent bur, peeling and scattering of a metal thin film of a pad electrode when it is cut along the scribing region of a semiconductor chip. SOLUTION: At least three electrode pieces 5a, 5b and 5c are arranged in a widthwise direction of the scribing region 3 crossing a scribing direction as the pad electrodes 5. When an electric characteristic of a monitor element 4 is evaluated, a measuring probe can securely be brought into contact with the pad electrodes 5. When the semiconductor chip is divided into individual chips, a blade is made to abut on the center of the scribing region 3. Thus, the pad electrodes 5 (electrode pieces 5a and 5c) at the edge of the scribing region 3 can be cut without depressing them. Then, occurrence of bur, peeling and scattering of the metal thin film at the edge can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI