发明名称 |
Package substrate for integrated circuit and method of making the substrate |
摘要 |
In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second dielectric layer in contact with a second face of the metal layer. The second face of the metal layer is opposite to the first face of the metal layer. The metal layer may be a continuous sheet having slots formed therein to allow the first and second dielectric layers to adhere to each other by way of the slots. |
申请公布号 |
US2005111207(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20030723414 |
申请日期 |
2003.11.26 |
申请人 |
WOOD DUSTIN P.;THURSTON MARK E.;SURYAKUMAR MAHADEVAN |
发明人 |
WOOD DUSTIN P.;THURSTON MARK E.;SURYAKUMAR MAHADEVAN |
分类号 |
H01L23/498;H01L23/50;H05K1/02;(IPC1-7):H05K1/03 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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