| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method by which an extremely thin wafer stuck to an adhesive sheet can be diced satisfactorily. SOLUTION: In the dicing method, the wafer is incompletely diced by leaving a small amount of uncut portion by using a first dicing blade 10 having a V-shaped front end and a plurality of V-shaped notches 10B in its outer peripheral section. Then the wafer is completely cut by cutting the uncut portion by using a second dicing blade 11, in which the grain size and degree of concentration of abrasive grains are respectively adjusted to #4,000-6,000 and 60-90 and which has an extremely thin edge thickness of 10-30μm and a plurality of V-shaped notches 11B is formed in its outer peripheral section. COPYRIGHT: (C)2005,JPO&NCIPI |
