发明名称 PROCESSED JOINED BODY FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a joined body comprising a substrate, particularly, a very thin substrate having a thickness of less than 0.3 mm and a retaining substrate, wherein the substrate is separably joined indirectly to the retaining substrate. SOLUTION: In the joined body, a spacing layer having a space between the substrate and the retaining substrate is incorporated, and the space is formed at least on the surface of the spacing layer directed to the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005119307(A) 申请公布日期 2005.05.12
申请号 JP20040302193 申请日期 2004.10.15
申请人 SCHOTT AG;KONINKL PHILIPS ELECTRONICS NV 发明人 HERMENS HARRIE;BOMMEL MARK VAN;PLICHTA ARMIN;ZETTERER THOMAS
分类号 G02F1/1333;B32B3/18;B32B3/24;B32B3/26;B32B7/06;B32B17/00;B32B17/06;G02F1/13;(IPC1-7):B32B3/24;G02F1/133 主分类号 G02F1/1333
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