发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <p>Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.</p>
申请公布号 WO2005041630(A1) 申请公布日期 2005.05.06
申请号 WO2004JP15966 申请日期 2004.10.21
申请人 MATSUSHITA ELECTRIC INDUSRIAL CO., LTD.;YAKIYAMA, HIDEYUKI;EMOTO, YASUHIRO 发明人 YAKIYAMA, HIDEYUKI;EMOTO, YASUHIRO
分类号 H01L21/00;H05K13/02;(IPC1-7):H05K13/02 主分类号 H01L21/00
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