发明名称 |
PLANARIZATION SYSTEM AND METHOD USING A CARBONATE CONTAINING FLUID |
摘要 |
Disclosed herein are a system and method of polishing a layer of a substrate. The disclosed method includes providing a polishing apparatus adapted to impart relative movement between a polishing pad and a substrate having a first layer to be polished; providing a liquid medium having a pH between 4 and 11 to an interface between the substrate and the polishing pad, the liquid medium including a pH controlling substance including at least one of an acid and a base, a carbonate and a stabilizer additive comprising at least one selected from the group consisting of amino acids and polyacrylic acid; and moving at least one of the substrate and the polishing pad relative to the other to polish the layer of the substrate.
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申请公布号 |
US2005079709(A1) |
申请公布日期 |
2005.04.14 |
申请号 |
US20030605610 |
申请日期 |
2003.10.13 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DELEHANTY DONALD J.;HANNAH JAMES W.;HEENAN DANIEL M.;JAMIN FEN F.;ECONOMIKOS LAERTIS |
分类号 |
B24B7/22;B24B37/04;C09G1/04;H01L21/302;H01L21/3105;H01L21/461;(IPC1-7):H01L21/302 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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