| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing method wherein a dicing guide is not required to get large in width, and a blade is hardly affected by adhesive material applied on the surface of a dicing tape even when it cuts into the dicing tape. <P>SOLUTION: A wafer is diced with a first blade 8A of high processing accuracy so far as only a very small amount of a region is left uncut. Thereafter, a second blade 8B mainly used for cutting the dicing tape 9 is tilted at an angle of 5° or below, preferably 3° with a direction perpendicular to a wafer so as not to come into contact with a first diced plane, and the uncut region and the upper part of the dicing tape are cut off by the second blade 8B. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
