发明名称 |
Heat dissipation apparatus |
摘要 |
A heat dissipation apparatus for a processor P comprises a heat sink 102 attached to the processor and having an internal chamber 128. The heat sink is also provided with at least one hollow prong 112 in fluid communication with the internal chamber. A first fan 124 may be provided to force a cooling fluid, such as air, into the internal chamber and though the hollow prongs. A second (external) fan 126 may be provided to create an external fluid flow over the exterior surface of the hollow prongs. |
申请公布号 |
GB2406719(A) |
申请公布日期 |
2005.04.06 |
申请号 |
GB20040018976 |
申请日期 |
2004.08.25 |
申请人 |
* HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
ELIAS * GEDAMU;DENISE * MAN |
分类号 |
H01L23/367;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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