ANISOTROPICALLY CONDUCTING ADHESIVE AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an anisotropically conducting adhesive excellent in low connection resistance, high insulation reliability and microcircuit connectivity. SOLUTION: The anisotropically conducting adhesive comprises at least a curing agent, a curable insulating resin and a conductive particulate, wherein 70 volume% or more of the conductive particulate is a generally polyhedral metal particulate with an average particle size of 0.01-3.0μm. COPYRIGHT: (C)2005,JPO&NCIPI