| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing, having excellent crack resistance and moisture proof reliability at high temperature, and also having good flame retardancy; and to provide a semiconductor device using the resin composition. SOLUTION: The resin composition for the sealing comprises (A) an epoxy resin represented by general formula (1) (wherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each a hydrogen atom or a methyl group; and n is an integer of 0 or≥1), (B) a phenol resin-curing agent represented by general formula (2) (wherein, n is an integer of 0 or≥1), (C) an inorganic filler, (D) 1,8-diazabicyclo[5.4.0]undecene-7, (E) a silane coupling agent, (F) a zirconium-based inorganic ion exchanger and (G) an adhesion-imparting agent represented by general formula (3) (wherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each a hydrogen atom or a methyl group) or general formula (4) as essential components, and the content of (C) the inorganic filler is regulated so as to be 25-95 wt.% based on the whole amount of the resin composition. The resin-sealed semiconductor device is obtained by sealing a semiconductor chip with a cured product of the resin composition. COPYRIGHT: (C)2005,JPO&NCIPI |
