发明名称 |
Polishing composition for semiconductor wafers |
摘要 |
An aqueous composition is useful for polishing semiconductor wafers. The composition comprises a nonionic surfactant that suppresses removal rate of silicon carbide-nitride and has a hydrophilic group and a hydrophobic group. The hydrophobic group has a carbon chain length of greater than three. And the nonionic surfactant suppresses silicon carbide-nitride removal rate at least 100 angstroms per minute greater than its decrease in silicon nitride removal rate as measured with a microporous polyurethane polishing pad pressure measured normal to a wafer of 13.8 kPa.
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申请公布号 |
US2005056810(A1) |
申请公布日期 |
2005.03.17 |
申请号 |
US20030664722 |
申请日期 |
2003.09.17 |
申请人 |
BIAN JINRU;QUANCI JOHN;VANHANEHEM MATTHEW R. |
发明人 |
BIAN JINRU;QUANCI JOHN;VANHANEHEM MATTHEW R. |
分类号 |
B24B37/00;C09G1/02;C09K3/14;H01L21/304;(IPC1-7):C09K13/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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