| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of suppressing sputter in a space of a target joining part, and preventing mixing of impurities in a deposited film and local consumption of the joining part. SOLUTION: In the sputtering apparatus for performing film deposition on a base plate by sputtering a composite target consisting of a plurality of targets of different materials, a boundary line 34 between the targets 32 and 33 on a sputtering surface 31a of the composite target 31 is formed of a line not parallel to the projecting direction of the axis of irradiation of ion beams (particle beams) 16 irradiated on the sputtering surface, and periodically repeated in the projecting direction. COPYRIGHT: (C)2005,JPO&NCIPI
|
