发明名称 FLASH MEMORY DEVICE AND MANUFACTURING METHOD THEREOF CAPABLE OF ELECTRICALLY ISOLATING MEMORY BLOCKS FROM ONE ANOTHER USING TRENCH OPERATION AND OXIDE LAYER
摘要 PURPOSE: A flash memory device and a manufacturing method thereof are provided to reduce a chip size by reducing a distance between memory blocks by electrically isolating memory blocks from one another using a trench operation and an oxide layer. CONSTITUTION: A flash memory device includes a first substrate(11), a second substrate(13), and a device isolation layer(12). The first substrate includes a plurality of trenches formed in a predetermined pattern thereon. The second substrate is formed in the trench and includes a plurality of memory cells(14) formed in an array thereon. The device isolation layer is formed between the first and second substrates to electrically isolate the first substrate from the second substrate.
申请公布号 KR20050014970(A) 申请公布日期 2005.02.21
申请号 KR20030053405 申请日期 2003.08.01
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 SEOK, SE WOON
分类号 H01L27/115;(IPC1-7):H01L27/115 主分类号 H01L27/115
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