BGA SEMICONDUCTOR PACKAGE HAVING SOLDER BALL LAND STRUCTURE OF MIXED SMD AND NSMD TYPE FOR IMPROVING RELIABILITY

摘要

PURPOSE: A BGA semiconductor package having a solder ball land structure of a mixed SMD and NSMD type is provided to improve reliability by preventing detachment of solder balls, crack of patterns, and separation of a solder ball land. CONSTITUTION: A first extension line extends from a land center of a solder ball land(30) to a mounting face of a solder ball. A first contact point is an intersection between the first extension line and a rim of the solder ball land. A second contact point is an intersection between the first extension line and a mask rim of a mask open region(37). A third contact point is an intersection between a second extension line and a land rim. The first least distance between the first contact point and the land center is longer than the second least distance between the second contact point and the land center. The third least distance between the third contact point and the land center is shorter than the fourth least distance between the fourth contact point and the land center.