| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum tweezer capable of suppressing a flaw and dirt from being generated and sticking to the surface of a semiconductor wafer adjacent to an extracted wafer or a returned wafer in the case of extracting one by one from a carrier containing a plurality of the semiconductor wafers or returning the wafer to the carrier. SOLUTION: The vacuum tweezer 100 is used to extract one semiconductor wafer from the carrier containing a plurality of the semiconductor wafers or to return the semiconductor wafer to the carrier. The tweezer is formed with a suctioning groove 6 for vacuum-suctioning the rear side of the semiconductor wafer, a touch sensor 4 provided to the rear side of the suctioning groove 6 and for sensing a contact of the semiconductor wafer with adjacent semiconductor wafers, and an alarming tower for raising a warning by the sensing of the contact by the touch sensor 4. COPYRIGHT: (C)2005,JPO&NCIPI |
