SEDIMENTATED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sedimentated wiring board whose lamination can be attained without using adhesive layers which cause problems such as the deterioration of electric characteristics such as characteristic impedance and the increase of thickness and weight. SOLUTION: In a wiring board 30 constituted by forming a wiring line 33 on at least one surface of a base material 24, a wiring bottom which is at least a part of the wiring line 33 is sedimentated from the base material surface by a hot press or the like to manufacture a sedimentated wiring board 40. Parts such as a printed board and an IC package are manufactured by using the sedimentated wiring board 40. COPYRIGHT: (C)2005,JPO&NCIPI