LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a light emitting element having an element substrate bonded to an emission layer part through a contact metal layer and a reflection metal layer in which the emission layer part is insusceptible to diffusion of components from the contact metal layer even if the contact metal layer is subjected to heat treatment for alloying.

SOLUTION: In the light emitting element 100, a contact metal layer 32 is interposed between a compound semiconductor 60 and a main metal layer 10 in order to reduce contact resistance between them. A part of the compound semiconductor 60 between the contact metal layer 32 and an emission layer part 24 exhibits translucency to a light beam from the emission layer part 24 and serves as a semiconductor layer 25 for blocking diffusion of components from the contact metal layer 32 into the emission layer part 24. When the diffusion blocking semiconductor layer 25 is composed of AlGaAs, diffusion of Ge, Ni and Au from the contact metal layer 32 into the emission layer part 24 is suppressed effectively.

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