SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

摘要

A processing tank (10) is divided into a washing section (15) and a drying section (30), with a clearance formed in the joint between the two sections, the clearance communicating with a sink (29). At the substrate drying time, the substrate is moved from the washing section to the drying section. A porous plate (28) is inserted in the lower region where the clearance is formed. A drying gas is jetted against the substrate with the internal pressure of the drying section (30) kept higher than that of the sink (29) and the internal pressure of the washing section (15) kept lower than that of the drying section (30). In this case, the porous plate (28) is preferably a punching plate having a plurality of small holes of predetermined diameter. Such arrangement provides a substrate processing method and device, capable of supplying a drying gas to an assembly of a plurality of substrates uniformly and stably.