COPPER ALLOY BASED THIN PLATE LEAD FRAME WITH PREDETERMINED DIE PAD CUP FOR PACKAGING SURFACE MOUNTING DEVICE(SMD) LED AND SMD LED THEREBY

摘要

PURPOSE: A copper alloy based thin plate lead frame for packaging SMD(Surface Mounting Device) LED(Light Emitting Diode) and the SMD LED thereby are provided to improve emissive efficiency and lifetime at low costs by enhancing the structure of the lead frame using a predetermined die pad cup. CONSTITUTION: An anode(125) and a cathode(120) are spaced apart from each other within a lead frame substrate. A die pad cup(135) for mounting an LED chip is formed at the center of the lead frame substrate. The die pad cup includes a convex mirror or a concave mirror for guiding reflective light to a predetermined direction.