METHOD OF FORMING MICRO VIA HOLES OF PRINTED CIRCUIT BOARD, INCLUDING STEP OF PRE-PROCESSING PORTION OF COVER LAY WHERE MICRO VIA HOLES ARE TO BE FORMED, AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME

摘要

PURPOSE: A method and a printed circuit board are provided to achieve improved reliability of plating of micro via holes, by removing, in advance, cover lay of micro hole portion where laser is to be applied. CONSTITUTION: A method of forming micro via holes of a printed circuit board, comprises a step(S401) of forming a circuit pattern on a copper foil layer of a flexible copper clad laminate having a rigid portion and a flexible portion; a step(S402) of pre-processing a portion of a cover lay where micro via holes are to be formed, wherein the cover lay protects the circuit pattern formed in the step(S401); a step(S403) of bonding the cover lay to the copper foil layer on which the circuit pattern is formed; a step(S404) of laminating an insulation layer on the cover lay; and a step(S405,S406) of forming a flexible copper clad laminate on the insulation layer, forming micro via holes, and forming a circuit pattern.