发明名称 |
Package for electronic device, base substrate, electronic device and fabrication method thereof |
摘要 |
A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.
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申请公布号 |
US2004226741(A1) |
申请公布日期 |
2004.11.18 |
申请号 |
US20040795444 |
申请日期 |
2004.03.09 |
申请人 |
MASUKO SHINGO;KAWACHI OSAMU;KOORIIKE TAKUMI |
发明人 |
MASUKO SHINGO;KAWACHI OSAMU;KOORIIKE TAKUMI |
分类号 |
H01L23/04;H03H9/08;(IPC1-7):H05K7/06 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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