| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a wiring board with solder bumps in which a micropad and a solder bump can be bonded rigidly. SOLUTION: The wiring board with solder bumps comprises an insulating substrate 1 provided, on the surface thereof, with a solder bonding pad 3 and a resin layer 4 having an opening 4a for exposing the central part of the pad 3, a resin bonding layer 11 containing metal powder applied to the inner side face of the opening 4a, and a solder bump 5 bonded to the inside of the opening 4a. COPYRIGHT: (C)2005,JPO&NCIPI
|
