发明名称 |
MOISTURE CURABLE ADHESIVE COMPOSITION |
摘要 |
The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive comprising a polymer or copolymer including reactive silicon end groups; from about 0.01 to about 40 percent by weight of a clear filler that will not substantially interfere with the clarity of the adhesive; and from about 0.01 to about 10 percent by weight of a dehydrating agent. In another embodiment, the present invention includes a moisture curable adhesive comprising a copolymer including a reactive silicon group; from about 33 to about 85 percent by weight of a filler; and from about 0.01 to about 10 percent by weight of a dehydrating agent. The present invention is further directed to a method of joining two adherends. |
申请公布号 |
EP1476521(A1) |
申请公布日期 |
2004.11.17 |
申请号 |
EP20030711032 |
申请日期 |
2003.02.14 |
申请人 |
THE GLIDDEN COMPANY |
发明人 |
KASZUBSKI, GLEN;PAUL, JOHN, A.;STYPCZYNSKI, MARK;TISCHER, LEO, AUGUST |
分类号 |
C08G65/336;C09J5/00;C09J11/00;C09J123/00;C09J171/02;C09J183/12;C09J201/10;(IPC1-7):C09J201/10;C09J143/04;C09J157/06 |
主分类号 |
C08G65/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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