| 发明名称 |
SEMICONDUCTOR MEMORY AND SYSTEM USING THE SAME |
| 摘要 |
A semiconductor memory may include a plurality of stacked semiconductor chips which are interconnected using through-chip vias. The semiconductor memory may set chip IDs of the respective semiconductor chips by using a chip code such that the chip IDs are different from each other, and perform a through-chip via test for the plurality of stacked semiconductor chips by changing the chip IDs of the respective semiconductor chips during a test mode period. |
| 申请公布号 |
US2016189802(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514636917 |
申请日期 |
2015.03.03 |
| 申请人 |
SK hynix Inc. |
发明人 |
KIM Ji Hwan |
| 分类号 |
G11C29/00;G11C29/14 |
主分类号 |
G11C29/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor memory comprising a plurality of stacked semiconductor chips which are interconnected using through-chip vias,
wherein the semiconductor memory sets chip IDs of respective semiconductor chips by using a chip code such that the chip IDs are different from each other, and performs a through-chip via test for the plurality of stacked semiconductor chips by changing the chip IDs of the respective semiconductor chips during a test mode period. |
| 地址 |
Icheon-si Gyeonggi-do KR |
