| 摘要 |
A method is disclosed of associating a component source with a destination circuit board in a component placement machine equipped with a component carrier tape having a first portion positioned to deliver components for subsequent placement onto the destination circuit board and a second portion attached to the first portion by a splice. The method includes sequentially removing a plurality of components from the component carrier tape for subsequent placement onto a destination circuit board, beginning with the first portion of tape, scanning a section of the component carrier tape associated with each removed component using a scanner that is responsive to the splice and, finally, creating an association between the destination circuit board and the second portion of tape in response to the scanner detecting the splice.
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