| 摘要 |
PURPOSE: An adhesive and an adhesive polyimide film using the adhesive are provided, to improve adhesion, heat resistance, flexibility and a dielectric property at high frequency. CONSTITUTION: The adhesive comprises an organic solvent solution containing the polyimide having a repeating unit represented by the formula I, wherein R is a tetravalent group derived from cyclohexane; Φ is a C2-C39 divalent aliphatic, alicyclic or aromatic group or their combination; and the main chain of Φ can be interposed by at least one group selected from the group consisting of -O-, -SO2-, -CO-, -CH2-, -C(CH3)2-, -OSi(CH3)2-, -C2H4O- and -S-. Preferably the organic solvent is at least one selected from the group consisting of N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, dimethyl sulfoxide, hexamethyl phosphoramide, tetramethylene sulfone, p-chlorophenol, m-cresol, γ-butyrolactone, propylene carbonate, dioxane and 2-chloro-4-hydroxytoluene. Preferably the polyimide has a glass transition temperature of 350 deg.C or less and a dielectric constant of 3.2 or less at 10 GHz. |
