| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coating application head capable of stably laying a liquid coating film to a laying region of a nonsquare shape, such as a circular shape. <P>SOLUTION: The coating application head to be used for a slit coating method of forming the liquid coating film on a substrate is formed with a structure capable of moving two L-shaped lip members relatively in a slit width direction with each other to form the structure by which the slit width (the outlet width of the coating liquid) can be varied. The coating liquid is applied uniformly to the coating region of the substrate while the amount of supply of the coating liquid necessary for the formation of the film thickness of the liquid coating film to be applied, the outlet width and the speed (coating application speed) at which the coating application head is moved relatively with the substrate are synchronized. Also, the shape of the coating application region where the coating liquid is applied is the nonsquare shape, such as the circular shape, on the semiconductor wafer substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
